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BCM 352 x 125 y 300 A00
? Recommended fuse: ≤ 2.5 A Bussmann PC-Tron or
lower than 400 Ω and toggle rate lower than 1 Hz.
capability (only 150 k Ω typical pull down is present),
5.0 USING THE CONTROL SIGNALS TM AND PC
The PC control pin can be used to accomplish the following
functions:
? Delayed start: At startup, PC pin will source a constant
100 uA current to the internal RC network. Adding an
external capacitor will allow further delay in reaching the
2.5 V threshold for module start.
? Synchronized start up: In a parallel module array, PC pins
shall be connected in order to ensure synchronous start of all
the units. While every controller has a calibrated 2.5 V
reference on PC comparator, many factors might cause
different timing in turning on the 100 uA current source on
each module, i.e.:
– Different V IN slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be
shared and all the modules will be enabled synchronously.
? Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM? bus converter
PC provides a regulated 5 V, 2 mA voltage source.
? Output Disable: PC pin can be actively pulled down in order
to disable module operations. Pull down impedance shall be
? Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
It is important to notice that PC doesn’t have current sink
therefore, in an array, PC line will not be capable of disabling
all the modules if a fault occurs on one of them.
The temperature monitor (TM) pin provides a voltage propor-
tional to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
? Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by x100. (i.e. 3.0 V = 300 K = 27 oC). It is important to
remember that VI Chip ? products are multi-chip modules,
whose temperature distribution greatly vary for each part
number as well with input/output conditions, thermal
management and environmental conditions. Therefore, TM
cannot be used to thermally protect the system.
? Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage is
re-enabled.
6.0 FUSE SELECTION
VI Chip products are not internally fused in order to provide
flexibility in configuring power systems. Input line fusing of
VI Chip modules is recommended at system level, in order to
provide thermal protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
? Current rating
(usually greater than maximum bus converter current)
? Maximum voltage rating
(usually greater than the maximum possible input voltage)
? Ambient temperature
? Nominal melting I 2 t
SOC type 36CFA.
BCM ? Bus Converter
Page 14 of 18
Rev 1.7
1/2013
vicorpower.com
800 735.6200
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